Lead frame Manufacture

In addition to the emphasis on its own research and development, we are also actively seeking excellent cooperation units, strive for technical interaction and growth opportunities: Manufacturer complement the creation of a stamping die mold with Japan and Germany, and plating equipment manufacturers in Japan with excellent production system, and domestic academic research cooperation with the introduction of new technology, by Yee Fang Chemical chemical Technology, to recruit a senior consultant in Japan...and so on. continuous self-improvement, commitment to our customers with quality!

Lead frame design, production and manufacture of various types and we also provide customized products ,please feel free to contact us.

 

SOT DIP HSOP
SOT(Small Outline Transistor)小型封裝二極體 DIP(Dual-in-line Package)雙邊引腳型插件式封裝,一般外腳 pitch 為100 mil HSOP(Heat SOP)IC熱量較大之小型表面黏著型封裝。表示導線架設計時,會將部份外腳連在一起,並與pad相連,好像翅膀一樣,以便pad上之晶片藉由導線架進行散熱。
LOC LQFP MSOP
LOC(Lead On Chip)「導線架的腳在晶片上方」之表面黏著型封裝。目前所知的有:「SOJ型LOC」(本公司命名為SOJ-LOC)、「TFP型LOC」(本公司命名為TFP-LOC)、「TSOP(II)型LOC」(本公司命名為TSOP(II)-LOC)三種。常見應用產品:16M以上DRAM記憶體IC產品 LQFP(Low Profile Quad Flat Package)超薄四邊引腳之扁平表面黏著型封裝。外腳pitch為0.5 mm。 MSOP(Matrix SOP)SOP用矩陣方式生產所需的導線架。
PLCC TSOP PSOP
PLCC(Plastic Leadless / Leaded Chip Carrier)四邊無引腳/有引腳之表面黏著型塑膠封裝。有引腳的最終外腳形狀彎曲如J形,朝向膠體。常見應用產品:SRAM、ROM、EPROM、EEPROM、FLASH、微控制器 TSOP(Thin Small Outline Package)超薄小型SOP。TSOP又分type I及type II兩種型式:type I是外腳由膠體的短邊伸出,標示為TSOP(I);type II是外腳由膠體的長邊伸出,標示為TSOP(II)。 PSOP(Power SOP)IC熱量較大之小型表面黏著型封裝。與HSOP是相同的。
QFP QSOP S-DIP
QFP(Quad Flat Package)四邊引腳之扁平表面黏著型封裝。一般即為PQFP。常見應用產品:晶片組、微處理器、VGA邏輯IC QSOP(Quarter Size Small Outline Package)1/4尺寸之SOP。 S-DIP  (Shrink Dual-in-line Package)  pitch縮小型DIP。
SIP Skinny DIP SSOP
SIP(Single In-Line Package)單列引腳型插件式封裝。常見應用產品:功率電晶體 Skinny DIP:膠體寬度較DIP窄,但外腳Pitch與DIP相同之雙邊引腳型插件式封裝。亦可稱為SK-DIP。 SSOP(Small Small Outline Package)更小型SOP之封裝。
SOJ SOP TSSOP
SOJ(Small Outline J-Lead)J型腳小型封裝。最終外腳形狀彎曲如J形,朝向膠體。常見應用產品:SRAM、EPROM、EEPROM、FLASH SOP(Small Outline Package)小型封裝。最終外腳形狀彎曲如L形,朝向膠體之外。常見應用產品:線性IC、邏輯IC、DRAM、SRAM TSSOP(Thin Small Small Outline Package)超薄更小型SOP()之英文縮寫。

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